From: Caleb Connolly <caleb.connolly@linaro.org>
To: Andy Gross <agross@kernel.org>,
Bhupesh Sharma <bhupesh.linux@gmail.com>,
Bjorn Andersson <andersson@kernel.org>,
Konrad Dybcio <konrad.dybcio@linaro.org>,
Mathieu Poirier <mathieu.poirier@linaro.org>,
Rob Herring <robh+dt@kernel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
Conor Dooley <conor+dt@kernel.org>,
"Rafael J. Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@linaro.org>,
Amit Kucheria <amitk@kernel.org>, Zhang Rui <rui.zhang@intel.com>,
Sibi Sankar <quic_sibis@quicinc.com>,
Manivannan Sadhasivam <mani@kernel.org>,
Thara Gopinath <thara.gopinath@gmail.com>
Cc: linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org,
devicetree@vger.kernel.org, linux-pm@vger.kernel.org,
Caleb Connolly <caleb.connolly@linaro.org>
Subject: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support
Date: Fri, 29 Sep 2023 17:16:16 +0100 [thread overview]
Message-ID: <20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org> (raw)
The Thermal Mitigation Device (TMD) Service is a QMI service that runs
on remote subsystems (the modem and DSPs) on Qualcomm SoCs.
It exposes various mitigations including passive thermal controls and
rail voltage restrictions.
This series introduces support for exposing TMDs as cooling devices
in the kernel through the thermal framework, using the QMI interface.
Each TMD client is described as a child of the remoteproc node in
devicetree. With subnodes for each control.
This series is based on previous work by Bhupesh Sharma which can be
found at [1]. I'm sending this as a fresh series as it has been a
year since the original version and I have rewritten most of the driver.
[1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@linaro.org/
---
Caleb Connolly (4):
remoteproc: qcom: probe all child devices
dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
thermal: qcom: add qmi-cooling driver
MAINTAINERS: Add entry for Qualcomm Cooling Driver
.../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 +
.../bindings/remoteproc/qcom,pas-common.yaml | 6 +
.../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++
MAINTAINERS | 8 +
drivers/remoteproc/qcom_q6v5.c | 4 +
drivers/remoteproc/qcom_q6v5_mss.c | 8 -
drivers/thermal/qcom/Kconfig | 13 +
drivers/thermal/qcom/Makefile | 1 +
drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++
drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++
10 files changed, 1161 insertions(+), 8 deletions(-)
---
base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812
// Caleb (they/them)
next reply other threads:[~2023-09-29 16:16 UTC|newest]
Thread overview: 24+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-09-29 16:16 Caleb Connolly [this message]
2023-09-29 16:16 ` [PATCH 1/4] remoteproc: qcom: probe all child devices Caleb Connolly
2023-09-29 16:16 ` [PATCH 2/4] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings Caleb Connolly
2023-09-29 17:15 ` Rob Herring
2023-11-07 3:55 ` Bjorn Andersson
2023-09-29 16:16 ` [PATCH 3/4] thermal: qcom: add qmi-cooling driver Caleb Connolly
2023-09-29 16:28 ` Konrad Dybcio
2023-09-29 16:56 ` Caleb Connolly
2023-10-16 21:10 ` Daniel Lezcano
2023-09-29 16:16 ` [PATCH 4/4] MAINTAINERS: Add entry for Qualcomm Cooling Driver Caleb Connolly
2023-09-29 17:17 ` [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Konrad Dybcio
2023-09-29 18:27 ` Caleb Connolly
2023-10-01 15:57 ` Manivannan Sadhasivam
2023-10-01 17:26 ` Caleb Connolly
2023-10-02 14:52 ` Manivannan Sadhasivam
2023-10-02 15:00 ` Dmitry Baryshkov
2023-10-02 15:14 ` Caleb Connolly
2023-10-02 15:58 ` Manivannan Sadhasivam
2023-10-02 16:00 ` Dmitry Baryshkov
2023-10-02 16:13 ` Manivannan Sadhasivam
2023-10-02 16:28 ` Neil Armstrong
2023-10-05 2:36 ` Bjorn Andersson
2023-10-10 12:24 ` Manivannan Sadhasivam
2023-10-05 2:52 ` Bjorn Andersson
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